Sony Semiconductor Solutions, TSMC sign preliminary JV MoU

Sony Semiconductor Solutions and TSMC signed a non-binding memorandum of understanding for a possible joint venture to develop and manufacture next-generation image sensors, according to a Mobile World Live report published in August 2025. The companies also said they would jointly explore physical AI applications in automotive and robotics.

The proposed joint venture would have Sony as the majority and controlling shareholder. Sony Semiconductor Solutions and TSMC said they are still assessing the scale of their investments, which would be made in stages based on market demand. The companies also said completion of the joint venture depends on a definitive binding agreement and other customary conditions, and that they expect support from the Japanese government.

Sony said it would install development and production lines at its new plant in Koshi, Japan. The companies said the partnership would combine Sony's image sensor design capabilities with TSMC's process technology and manufacturing capabilities to improve image sensor performance. The report said details of the possible collaboration in automotive and robotics remain limited. It also noted that Sony Semiconductor Solutions spun off Israeli company Altair Semiconductor last month while retaining a stake.