Broadcom and Apple extend custom chip deal through 2031
TL;DR
- Broadcom and Apple extended their custom chip partnership through 2031, according to a US Securities and Exchange Commission filing dated 6 July.
- Broadcom will develop and supply custom ASIC chips, including iPhone radio frequency components, Wi-Fi chips, Bluetooth chips, and other networking semiconductors.
- The agreement indicates Apple will continue using Broadcom components across multiple future product generations alongside its in-house modem efforts.
Broadcom and Apple extended their custom chip partnership through 2031, according to a US Securities and Exchange Commission filing dated 6 July. The filing states Broadcom will develop and supply a range of custom ASIC chips for use across multiple generations of Apple products.
The chips covered by the agreement include radio frequency components used in iPhones for cellular connectivity, along with Wi-Fi and Bluetooth connectivity chips and other networking semiconductors. Broadcom previously signed a multibillion-dollar agreement with Apple in 2023 covering the development and manufacture of 5G radio frequency components.
Broadcom is a long-standing Apple supplier, and analysts estimate Apple accounts for about 20% of Broadcom’s annual revenue. Apple has also been developing its own modem chips: its C1 modem debuted early last year in the iPhone 16e, and reports cited in the source said Apple’s C2 modem is expected in the iPhone 18 Pro series, while Reuters reported TSMC manufactures the C2 to Apple’s design.
Related questions
- What chips will Broadcom supply to Apple under the extended 2031 agreement?
- When did Broadcom and Apple file the partnership extension?
- How does Apple’s Broadcom deal relate to its C1 and C2 modem plans?
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More articles and news tagged with: Broadcom, Apple, iPhone, iPhone 16e, iPhone 18 Pro, C1, C2, TSMC, Intel, US Securities and Exchange Commission, 5G, Wi-Fi, Bluetooth
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