OpenAI unveils Jalapeno inference chip with Broadcom
TL;DR: OpenAI unveiled Jalapeno, its first custom inference chip, developed with Broadcom and manufactured with support from Broadcom and Celestica. OpenAI said engineering samples are already running machine learning workloads at target production frequency and power, including GPT 5.3 Codex Spark. Initial deployment is scheduled for late 2026.
OpenAI unveiled Jalapeno, its first custom inference processor, in partnership with Broadcom, according to a Mobile World Live report published on 24 June 2026. OpenAI said Jalapeno is the first chip in a multigenerational computing platform that it is developing jointly with Broadcom for AI inference workloads.
OpenAI designed Jalapeno from scratch based on its model roadmap, cores, server systems, and product requirements, while Broadcom and Celestica handled chip manufacturing, board and rack integration, networking, and production scaling. OpenAI said the architecture is designed to reduce data movement and balance processing, memory, and network resources, and that Broadcom’s Tomahawk networking chip and integration technology form the base for large-scale production.
OpenAI said it is still finalizing performance measurements, but early tests indicate Jalapeno delivers higher performance per watt than current-generation AI accelerators. Bloomberg reported the accelerator is achieving cost savings of about 50% compared with typical AI graphics processing units. OpenAI also said the chip moved from initial design to fabrication in nine months, and that initial deployment is planned for late 2026.
More from Technology
Related Content
More articles and news tagged with: OpenAI, Broadcom, Celestica, Jalapeno, Tomahawk, GPT 5.3 Codex Spark, Microsoft, Bloomberg
Related Articles
Amazon acquires Globalstar for $11.57B, renews Apple satellite deal. EU clears Orange's MasOrange buyout. KORE-Kigen SGP.32 IoT eSIM. Sateliot raises €100M.
T-Mobile delivers record 7.8M postpaid adds, DT launches €1B AI cloud. US carriers go eSIM-default. Airalo-Valid partnership. MWC 2026 eSIM Summit preview.
Verizon closes Frontier deal, CES 2026 debuts eSIM AR glasses and IoT solutions, T-Mobile leads 5G-Advanced rollout. Weekly eSIM industry intelligence.
eSIM Weekly Dec 22-28, 2025: Christmas week brings Transpovia-Holafly travel partnership, Ooredoo industrial IoT launch. Verified sources + market analysis.
eSIM Weekly Report Dec 15-21, 2025: Roamless raises $12M, travel eSIM revenue drops 13%, SGP.32 buyers guide released. Market forecast: $5.8B by 2030.
IDC: Apple's iPhone Fold to capture 22% of foldable market. eSIM market forecast at $5.8B by 2030. AT&T vs T-Mobile hearing December 16.