IBM chip design claim challenges Huawei 3D packaging narrative

IBM said it has developed a new chip-packaging design that uses three-dimensional stacking to improve performance, in a report published by Light Reading on August 18, 2025.

Light Reading reported that IBM’s work centers on three-dimensional chip packaging, a design method that stacks components vertically rather than placing them only side by side. The article said this approach could improve chip performance, and compared IBM’s position with similar claims made by Huawei.

Huawei has also said that three-dimensional chip designs could improve performance, according to the Light Reading report. The report said IBM may have gone further than Huawei in the design it described, which weakens Huawei’s public narrative around this area of semiconductor development.

The source excerpt and description do not provide technical specifications, performance figures, product names, launch dates, or commercial deployment details. The available information is limited to the comparison between IBM’s and Huawei’s stated work on three-dimensional chip design.

Related questions

• What did IBM say about its three-dimensional chip-packaging design?
• How does Light Reading compare IBM’s chip design claim with Huawei’s?
• What details are publicly available about IBM’s and Huawei’s 3D chip approaches?