How long do eUICC chips last?
Industrial-grade eUICCs are designed for long-term deployments (10–15+ years) with extended temperature ranges (-40°C to +105°C) and resistance to environmental factors like vibration and corrosion.
Related FAQs
What does eUICC stand for?
eUICC stands for embedded Universal Integrated Circuit Card—a UICC with GSMA Remote SIM Provisioning (RSP) that enables multiple carrier profiles to be managed remotely.
What is the difference between eUICC and eSIM?
eUICC is the secure hardware storing carrier profiles. eSIM is the complete system combining eUICC, profiles, provisioning infrastructure, and device software.
Is eUICC always soldered or embedded?
No, eUICC can be embedded (MFF2) or removable (2FF, 3FF, 4FF sizes). The defining feature is Remote SIM Provisioning capability, not physical form factor.
How many profiles can an eUICC store?
eUICC profile capacity varies by memory size, profile complexity, and device policy. There's no fixed industry number—it depends on specific device and vendor implementation.
What is MFF2?
MFF2 (Machine Form Factor 2) is the standard embedded eUICC form factor at 5×6×0.75mm, soldered to device circuit boards. Defined by ETSI TS 102 671.
What is the difference between eUICC and iSIM?
eUICC is a discrete secure element chip. iSIM integrates SIM functionality directly into the device processor or modem, eliminating the separate chip. Both support remote provisioning.
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What is eUICC? Learn how embedded UICC enables eSIM technology, remote SIM provisioning, and the difference between SGP.22, SGP.32, and iSIM form factors.