Is eUICC always soldered or embedded?
No. While eUICC is commonly embedded (MFF2 form factor), it can also exist in removable SIM card sizes (2FF, 3FF, 4FF) that support remote provisioning. The defining feature is RSP capability, not the physical form.
Related FAQs
What does eUICC stand for?
eUICC stands for embedded Universal Integrated Circuit Card—a UICC with GSMA Remote SIM Provisioning (RSP) that enables multiple carrier profiles to be managed remotely.
What is the difference between eUICC and eSIM?
eUICC is the secure hardware storing carrier profiles. eSIM is the complete system combining eUICC, profiles, provisioning infrastructure, and device software.
How many profiles can an eUICC store?
eUICC profile capacity varies by memory size, profile complexity, and device policy. There's no fixed industry number—it depends on specific device and vendor implementation.
What is MFF2?
MFF2 (Machine Form Factor 2) is the standard embedded eUICC form factor at 5×6×0.75mm, soldered to device circuit boards. Defined by ETSI TS 102 671.
What is the difference between eUICC and iSIM?
eUICC is a discrete secure element chip. iSIM integrates SIM functionality directly into the device processor or modem, eliminating the separate chip. Both support remote provisioning.
Can eUICC switch between carriers automatically?
Yes, eUICC can download new profiles and switch carriers remotely with proper provisioning infrastructure. IoT deployments using SGP.32 automate this for entire device fleets.
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