Samsung starts shipping next‑gen HBM4 chips as memory prices surge

Samsung Electronics has begun shipping its latest high-bandwidth memory chips, HBM4, after moving into mass production of a sixth‑generation, 12‑layer design. The company expects HBM revenue to more than triple in 2026 and is preparing to scale up output, as global memory prices have jumped 80% to 90% since late 2025, according to Counterpoint Research.

Samsung fell behind SK Hynix and Micron on the previous HBM3E generation, winning Nvidia’s approval more than six months after its rivals. With HBM4, Samsung claims a steady processing speed of 11.7Gb/s, above the 8Gb/s industry standard, and says the new chip improves power efficiency by 40% versus its predecessor through low‑voltage through‑silicon vias and power distribution network optimisation. The shipping timeline aligns with a forecast from The Korean Economic Daily.