Samsung starts shipping next‑gen HBM4 chips as memory prices surge
Samsung Electronics has begun shipping its latest high-bandwidth memory chips, HBM4, after moving into mass production of a sixth‑generation, 12‑layer design. The company expects HBM revenue to more than triple in 2026 and is preparing to scale up output, as global memory prices have jumped 80% to 90% since late 2025, according to Counterpoint Research.
Samsung fell behind SK Hynix and Micron on the previous HBM3E generation, winning Nvidia’s approval more than six months after its rivals. With HBM4, Samsung claims a steady processing speed of 11.7Gb/s, above the 8Gb/s industry standard, and says the new chip improves power efficiency by 40% versus its predecessor through low‑voltage through‑silicon vias and power distribution network optimisation. The shipping timeline aligns with a forecast from The Korean Economic Daily.
More from Technology
TL;DR: Space Compass signed a memorandum of understanding with Apolink and JSAT International to explore optical data relay links between geosynchrono...
TL;DR: GNSS satellites provide positioning and timing used by smartphones, cars, and critical infrastructure. RCR Wireless News reported on April 10,...
TL;DR: Cisco detailed optical networking updates aimed at AI networking infrastructure, according to a Light Reading report. The report says Cisco foc...
TL;DR: Bangladesh Submarine Cables warned that internet services in Bangladesh may slow down or face disruptions until Monday. The disruption is linke...
TL;DR: Google is adding a new Notebooks feature to Gemini. Notebooks sync with NotebookLM so users can use content across both apps. The rollout has s...
TL;DR: Researchers detailed a prompt injection attack that bypassed Apple Intelligence protections on April 9, 2026. The issue let attackers circumven...